北京赛车PK10后三断组计划欢迎您的到來!

Main product is : HY-E series EPOXY MOLDING COMPOUND plastic, this product has six series(HY-E100~HY-E600) and hundred varieties. It mainly uses in semiconductor(diode,audion etc.), special type apparatus (highvoltage silicon rectifier stack, small and special electrical machine etc.), plastic encapsulation of small,middle and large scale molectron(DIP、SOP、QFP、BGA etc. style).
  PRODUCTS
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 Contact Us
Tel:86-579-87403976
      87403977
Fax:86-579-87403977
Phone:1375898678
E-mail:hydz@zjhydz.com
Add:xixi Yongkang City Zhejiang Province
http://www.384573.cn/
    Products 产品展示

Zhejiang Hengyao Electronics Material Co.,Ltd has special automatization product line of EPOXY MOLDING COMPOUND PLASTIC. Annual throughput is 2,500 Tons. Through company's unceasing innovation, provides high quality encapsulation material which the customer's needs--EPOXY MOLDING COMPOUND PLASTIC.

  • Epoxy Molding Compound
  • Packaging Samples
  • Packaging Samples
  • Packaging Samples
  • 1. Product Characteristics (typical)

    Project units
    Units
    HY-E100
    HY-E200
    HY-E300
    HY-E400
    HY-E500
    HY-E600
    Color
    -
    black
    black
    black
    black
    black
    black
    Gelation time 175 degrees
    s
    18
    30
    25
    25
    28
    30
    Flow length of 175 degrees
    cm
    70
    30
    75
    80
    90
    100
    Density

    g/cm3

    2.04
    2.10
    1.8
    1.83
    1.80
    1.78
    Flexural strength
    Mpa
    145.0
    160.0
    155.0
    145.0
    115.0
    135.0
    Flexural modulus
    Gpa
    14.0
    17.5
    14.5
    15.0
    13.0
    15.0
    Glass transition temperature
    165
    155
    170
    165
    158
    135
    Thermal expansion coefficient α1
    ppm/℃
    27
    24
    18
    17
    16
    13.5
    Thermal expansion coefficient α2
    ppm/℃
    72
    64
    65
    60
    62
    5.2
    Thermal conductivity
    w/m./℃
    1.45
    2.0
    0.8
    0.75
    0.75
    0.62
    Flame retardant (UL-94)
    -
    V-0
    V-0
    V-0
    V-0
    V-0
    V-0
    Volume Resistance
    Ω-cm
    2.5*1016  
    3.2*1016  
    2.9*1016  
    2.0*1016  
    1.0*1016  
    2.1*1016  
    Nα+
    ppm
    5
    5
    5
    3
    2
    2
    Cl_
    ppm
    15
    15
    13
    10
    8
    8
    PH
    -
    5.8
    6.0
    5.5
    5.3
    5.8
    5.4
    Uranium content
    ppm
    -
    -
    -
    -
    8
    8
    Performance
    -
    Fast curing, excellent formability
    High thermal conductivity, high adhesion
    Low expansion, high reliability, high voltage
    Low expansion, low stress, high reliability
    Low stress, low viscosity, low-uranium content, high purity
    Low stress, low viscosity, low hygroscopicity, low-uranium content, high purity, high-adhesion
    Apply  
    Diode Tr Medium、small IC
    The whole packaging Tr
    Tr,ICHigh-voltage silicon heap of special devices
    DIP SOP SOJ
    DIP SOP SOJ QFP
    SOT QFP TQFP LQFP
    2.Cake material specifications
    Diameter
    11
    13
    18
    40
    43
    48
    55
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